SEMICONDUCTOR DIE PACKAGES USING THIN DIES AND METAL SUBSTRATES

A semiconductor die package is disclosed. The semiconductor die package comprises a metal substrate, and a semiconductor die comprising a first surface comprising a first electrical terminal, a second surface including a second electrical terminal, and at least one aperture. The metal substrate is a...

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Bibliographic Details
Main Authors SAPP, STEVEN, LI, MINHUA, DIROLL, JOHN ROBERT, YILMAZ, HAMZA, WANG, QI, MURPHY, JAMES, J
Format Patent
LanguageEnglish
French
Published 18.10.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor die package is disclosed. The semiconductor die package comprises a metal substrate, and a semiconductor die comprising a first surface comprising a first electrical terminal, a second surface including a second electrical terminal, and at least one aperture. The metal substrate is attached to the second surface. A plurality of conductive structures is on the semiconductor die, and includes at least one conductive structure disposed in the at least one aperture. Other conductive structures may be disposed on the first surface of the semiconductor die. L'invention concerne un boîtier de puce de semiconducteur. Le boîtier de puce de semiconducteur comprend un substrat métallique, et une puce de semiconducteur comprenant un premier terminal électrique, une seconde surface comprenant un second terminal électrique, et au moins une ouverture. Le substrat métallique est fixé à la seconde surface. Plusieurs structures conductrices se trouvent sur la puce de semiconducteur, et comprennent au moins une structure conductrice placée dans l'ouverture. D'autres structures conductrices peuvent être placées sur la première surface de la puce de semiconducteur.
Bibliography:Application Number: WO2007US63903