PACKAGING OF MEMS DEVICES

The present invention is directed to a process for packaging a microelectrical, micromechanical, microelectromechanical (MEMS) or microfluidic component on a substrate by forming cavities made from crosslinked photoresists on an easily removable second substrate, bonding the cavities to third substr...

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Bibliographic Details
Main Authors NAGALE, MILIND, P, JOHNSON, DONALD, W
Format Patent
LanguageEnglish
French
Published 27.12.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:The present invention is directed to a process for packaging a microelectrical, micromechanical, microelectromechanical (MEMS) or microfluidic component on a substrate by forming cavities made from crosslinked photoresists on an easily removable second substrate, bonding the cavities to third substrates containing selected microdevices, then peeling off the removable second substrate. L'invention porte sur un procédé d'encapsulage de composants microélectriques, micromécaniques, microélectromécaniques (MEMS) ou microfluidiques sur un substrat en y formant des cavités à l'aide d'une photorésine réticulée déposée sur un deuxième substrat facilement décollable, puis en liant les cavités à un troisième substrat contenant les microdispositifs sélectionnés, puis en décollant le deuxième substrat.
Bibliography:Application Number: WO2007US06535