CIRCUIT BOARD MATERIALS WITH IMPROVED BOND TO CONDUCTIVE METALS AND METHODS OF THE MANUFACTURE THEREOF

Use of a roughened dielectric layer between a dielectric substrate and a conductive layer, which allows increased adhesion between layers without the conductor loss associated with roughened conductor layers, as well as improved accuracy in etching. The method is widely applicable to a variety of di...

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Bibliographic Details
Main Authors DAS, AMIT, SANKAR, PAUL, K, HORN, ALLEN, F., III, DAIGLE, ROBERT, C, BAARS, DIRK, M
Format Patent
LanguageEnglish
French
Published 19.07.2007
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:Use of a roughened dielectric layer between a dielectric substrate and a conductive layer, which allows increased adhesion between layers without the conductor loss associated with roughened conductor layers, as well as improved accuracy in etching. The method is widely applicable to a variety of dielectric substrate and conductive layer constructions, and can be readily tuned to provide the desired level of adhesion and other advantageous properties. Cette invention concerne l'utilisation d'une couche diélectrique rendue rugueuse entre un substrat diélectrique et une couche conductrice, ce qui a pour effet, outre d'accroître la précision de la gravure, d'améliorer la liaison entre les couches sans la perte de conductivité normalement associée à des couches conductrices rugueuses. Ce procédé peut être largement appliqué à des ensembles substrat diélectrique-couche conductrice et peut être facilement adapté afin de procurer le degré d'adhésion requis et autres propriétés intéressantes.
Bibliography:Application Number: WO2006US41066