SYSTEM AND METHOD FOR FORMING PATTERNED COPPER LINES THROUGH ELECTROLESS COPPER PLATING
A method for forming copper on a substrate including inputting a copper source solution into a mixer, inputting a reducing solution into the mixer, mixing copper source solution and the reducing solution to form a plating solution having a pH of greater than about 6.5 and applying the plating soluti...
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Main Authors | , , , , |
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Format | Patent |
Language | English French |
Published |
22.05.2009
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Subjects | |
Online Access | Get full text |
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Summary: | A method for forming copper on a substrate including inputting a copper source solution into a mixer, inputting a reducing solution into the mixer, mixing copper source solution and the reducing solution to form a plating solution having a pH of greater than about 6.5 and applying the plating solution to a substrate, the substrate including a catalytic layer wherein applying the plating solution to the substrate includes forming a catalytic layer, maintaining the catalytic layer in a controlled environment and forming copper on the catalytic layer. A system for forming copper structures is also disclosed.
Procédé de formation de cuivre sur un substrat englobant les opérations suivantes: introduction d'une solution de cuivre source, puis d'une solution réductrice dans un mélangeur; brassage des deux solutions dans le but d'obtenir une solution de plaquage d'un pH supérieur à environ 6.5; et application de la solution de plaquage sur un substrat contenant une couche catalytique. L'application de la couche de plaquage sur le substrat revient à former une couche catalytique, à maintenir ladite couche dans un environnement contrôlé et à former du cuivre sur la couche catalytique. Est également décrit un système de formation de structures de cuivre. |
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Bibliography: | Application Number: WO2006US34555 |