SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

A semiconductor die package comprising a premolded substrate including a leadframe strucutre and a molding material. The leadframe structure has a first conductive portion, a second conductive portion and a pad region. A cavity is located between the first and second conductive portions. An encapsul...

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Main Authors KENG, TAN TEIK, WU, CHUNG-LIN, CHOI, YOONHWA, GOOI, BOON HUAN, LIM, LAY YEAP, LEE, BUYONG-OK, JEON, OSEOB, JOSHI, RAJEEV, IYER, VENKAT, CHONG, DAVID, ESTACIO, MARIA, CRISTINA, B, NAM, SHIBAEK
Format Patent
LanguageEnglish
French
Published 19.04.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor die package comprising a premolded substrate including a leadframe strucutre and a molding material. The leadframe structure has a first conductive portion, a second conductive portion and a pad region. A cavity is located between the first and second conductive portions. An encapsulating material covers the semiconductor die on the premolded substrate. An exterior surface of the pad region and the molding material are substantially coplanar and coincide with a surface of the premolded substrate. L'invention porte sur des boîtiers de puces semi-conductrices dont un exemple comporte un substrat prémoulé auquel la puce peut être fixée, tandis qu'un matériau d'encapsulation peut être disposé au-dessus de la puce.
Bibliography:Application Number: WO2006US23851