SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die. L'invention porte sur des boîtiers de p...

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Main Authors KENG, TAN TEIK, WU, CHUNG-LIN, CHOI, YOONHWA, GOOI, BOON HUAN, LIM, LAY YEAP, LEE, BUYONG-OK, JEON, OSEOB, JOSHI, RAJEEV, IYER, VENKAT, CHONG, DAVID, ESTACIO, MARIA, CRISTINA, B, NAM, SHIBAEK
Format Patent
LanguageEnglish
French
Published 11.01.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die. L'invention porte sur des boîtiers de puces semi-conductrices dont un exemple comporte un substrat prémoulé auquel la puce peut être fixée, tandis qu'un matériau d'encapsulation peut être disposé au-dessus de la puce.
Bibliography:Application Number: WO2006US23851