MEMORY MODULE SYSTEM AND METHOD
A circuit module is provided in which two secondary substrates or cards or the rigid portions of a rigid flex assembly are populated with integrated circuits (ICs). The secondary substrates are connected with flexible circuitry. One side of the flexible circuitry exhibits contacts adapted for connec...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English French |
Published |
23.11.2006
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A circuit module is provided in which two secondary substrates or cards or the rigid portions of a rigid flex assembly are populated with integrated circuits (ICs). The secondary substrates are connected with flexible circuitry. One side of the flexible circuitry exhibits contacts adapted for connection to an edge connector. The flexible circuitry is wrapped about an edge of a preferably metallic substrate to dispose one of the two secondary substrates on a first side of the substrate and the other of the secondary substrates on the second side of the substrate.
L'invention concerne un module de circuit dans lequel deux substrats ou cartes secondaires ou les parties rigides d'un ensemble souple rigide sont garnies de circuits intégrés (IC). Les substrats secondaires sont connectés au moyen d'un ensemble de circuits souple. Un côté de celui-ci présente des contacts conçus pour être connectés à un connecteur latéral. L'ensemble de circuits souple est enveloppé autour d'un bord d'un substrat métallique de préférence, de manière à disposer un des substrats secondaires sur un premier côté du substrat et l'autre sur le second côté du substrat. |
---|---|
Bibliography: | Application Number: WO2006US04690 |