COOLING DEVICE FOR PRINTED CIRCUIT BOARDS AND METHOD FOR THE PRODUCTION THEREOF

• Main Authors: WEICHSELBAUMER, PETER, RIESE, DIRK, SCHMIDT, JOSEF
• Format: Patent
• Language: English; French; German
• Published: 26.04.2007
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING; VEHICLES IN GENERAL; VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISEPROVIDED FOR

Die Erfindung betrifft eine Kühlvorrichtung (1) für eine in einem Gehäuse (3) angeordnete Leiterplatte (2) , die mit einem Metallkühlkörper (4) , der als Deckel des Gehäuses (3) ausgebildet ist, rastend verbindbar ist. The invention relates to a cooling device (1) for a printed circuit board (2) which is disposed in a housing (3) and can be connected in a locking manner to a metal cooling element (4) that is embodied as a cover of said housing (3). L'invention concerne un dispositif de refroidissement (1) pour une carte de circuits (2) qui est placée dans un boîtier (3) et qui peut être raccordée de manière verrouillable à un dissipateur thermique métallique (4) conçu en tant que couvercle du boîtier (3).