ELECTRONIC PACKAGE EVALUATING APPARATUS, ELECTRONIC PACKAGE OPTIMIZING APPARATUS, AND COMPUTER READABLE RECORDING MEDIUM WHEREIN ELECTRONIC PACKAGE EVALUATION PROGRAM IS RECORDED

• Main Authors: SAKAI, HIDEHISA, KOBAYASHI, YOKO, OCHI, YOSHITERU
• Format: Patent
• Language: English; French; Japanese
• Published: 28.09.2006
• Edition: 7
• Subjects: CALCULATING; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; PHYSICS

In reliability evaluation of an entire electronic package, while shortening a time required for simulation, accurate analysis is performed especially to a solder bonding section. An overall analysis model creating section (21) creates a solder bonding section model having the same volume, height and...