N2-BASED PLASMA TREATMENT FOR POROUS LOW-K DIELECTRIC FILMS

A semiconductor device is fabricated by forming a low-k dielectric material (20) over a substrate (10), depositing a liner (65) on a portion of the low-k dielectric material, and exposing the liner to a plasma (70). A barrier layer may be deposited over the liner. On fabrique un dispositif en semi-c...

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Bibliographic Details
Main Authors SMITH, PATRICIA, BEAUREGARD, JIN, CHANGMING, AJMERA, SAMEER, KUMAR
Format Patent
LanguageEnglish
French
Published 10.08.2006
Subjects
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