ENGINEERED NON-POLYMERIC ORGANIC PARTICLES FOR CHEMICAL MECHANICAL PLANARIZATION

An abrasive composition comprising composite non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The composite particles individually contain at least one nonpolymeric organic component and at least o...

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Main Authors DUVVURU, VIVEK, LI, YUZHUO, CHEEMALAPATI, KRISHNAYYA, TANG, KWOK, BIAN, HENRY, LI, WU, BUNDI, DEENESH, BIAN, GUOMIN
Format Patent
LanguageEnglish
French
Published 13.07.2006
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
SEMICONDUCTOR DEVICES
SKI WAXES
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Summary:An abrasive composition comprising composite non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The composite particles individually contain at least one nonpolymeric organic component and at least one other chemical component different from the at least one nonpolymeric organic component. The slurry composition can be vastly simplified if one or more of the components are incorporated into the abrasive particles. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications. L'invention concerne une composition abrasive comprenant des particules organiques non polymères utiles pour la planarisation chimico-mécanique et pouvant être largement utilisées dans l'industrie des semiconducteurs. Les particules composites contiennent chacune au moins un composant organique non polymère et au moins un autre composant chimique différent du ou des composants organiques non polymères. La composition en suspension peut être largement simplifiée si un ou plusieurs composants sont incorporés dans les particules abrasives. Les compositions abrasives présentent un taux de polissage efficace, une excellente sélectivité, et de bonnes qualités de surface lorsqu'elles sont utilisées en tant que nouvelle composition abrasive dans des applications de planarisation chimico-mécaniques.
Bibliography:Application Number: WO2006US00216