THIN FILM FORMING APPARATUS AND METHOD THEREOF

• Main Authors: NAGAI, KAZUYOSHI, FUJIWARA, TAKAYUKI
• Format: Patent
• Language: English; French; Japanese
• Published: 27.04.2006
• Edition: 7
• Subjects: BASIC ELECTRONIC CIRCUITRY; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; RESONATORS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A utilization ratio of a target material, a tact time, maintenance easiness and film forming accuracy are improved by a thin film forming apparatus. The thin film forming apparatus is provided with a vacuum chamber, a sputter cathode for holding the target material, a placing means for placing a substrate to be deposited with the sputtered target material and a carrying mechanism for the placing means. In the carrying mechanism, a carrying path is provided so as to permit the substrate pass through the front side of the target material, and the placing means is composed of a substrate tray which can hold a plurality of substrates in juncture. Le rapport d'utilisation d'un matériau cible, le temps de cycle, la facilité de maintenance et la précision de formation de film sont améliorés grâce à un appareil de formation de film mince. L'appareil de formation de film mince est pourvu d'une chambre à dépression, d'une cathode à pulvérisation pour maintenir le matériau cible, d'un moyen de placement pour disposer un substrat sur lequel déposer le matériau cible pulvérisé et d'un mécanisme de transport pour le moyen de placement. Dans le mécanisme de transport, une trajectoire de transport permet le passage du substrat à travers le côté avant du matériau cible, et le moyen de placement est composé d'un plateau à substrats capable de contenir une pluralité de substrats de manière contiguë.