RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN

Disclosed is a resist composition obtained by dissolving a resin component (A) whose alkali solubility is changed by the action of an acid, an oxime sulfonate acid generator (B), an amine compound (D) having at least one alkyl group having 5-12 carbon atoms and an organic acid (E) in an organic solv...

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Bibliographic Details
Main Authors HIDESAKA, SHINICHI, NAKAGAWA, YUSUKE, NAKAYAMA, KAZUHIKO
Format Patent
LanguageEnglish
French
Japanese
Published 23.03.2006
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:Disclosed is a resist composition obtained by dissolving a resin component (A) whose alkali solubility is changed by the action of an acid, an oxime sulfonate acid generator (B), an amine compound (D) having at least one alkyl group having 5-12 carbon atoms and an organic acid (E) in an organic solvent (C) containing methyl-n-amylketone. The organic acid (E) component is composed of a dibasic acid. La présente invention décrit une formulation de matériau de protection pour appareillage électrique obtenu en dissolvant dans un solvant organique (C) contenant de la méthyl-n-amylcétone : une résine (A), dont la solubilité en milieu basique est modifiée par l'action d'un acide ; un précurseur d'acide de type sulfonate d'oxime (B) ; un dérivé d'amine (D) qui porte au moins un groupement alkyle comprenant entre 5 et 12 atomes de carbone ; et un acide organique (E). L'acide organique (E) inclut un diacide.
Bibliography:Application Number: WO2005JP15165