RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN

Disclosed is a resist composition used in a method for forming a resist pattern which includes an immersion exposure step. The resist composition contains a resin component (A) whose alkali solubility is changed by the action of an acid, and an acid generator component (B) which generates an acid th...

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Bibliographic Details
Main Authors TSUJI, HIROMITSU, YOSHIDA, MASAAKI
Format Patent
LanguageEnglish
French
Japanese
Published 26.01.2006
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:Disclosed is a resist composition used in a method for forming a resist pattern which includes an immersion exposure step. The resist composition contains a resin component (A) whose alkali solubility is changed by the action of an acid, and an acid generator component (B) which generates an acid through exposure, and an organic solvent (C) mainly containing at least one solvent (c1) selected from the group consisting of 2-heptanone and ethyl lactate. Cette invention a pour objet une composition d'enduit protecteur utilisée dans un procédé de formation d'un modèle d'enduit protecteur qui comprend une étape d'exposition en immersion. Cette composition d'enduit protecteur contient un composant résineux (A) dont la solubilité dans l'alcali est modifiée par l'action d'un acide, et un composant générateur d'acide (B) qui génère un acide par exposition, et un solvant organique (C) contenant principalement au minimum un solvant (c1) sélectionné dans le groupe composé de 2-heptanone et de lactate d'éthyle.
Bibliography:Application Number: WO2005JP12057