METHODS OF FORMING SOLDER BUMPS ON EXPOSED METAL PADS AND RELATED STRUCTURES
A method of forming an electronic structure may include providing a substrate having a metal pad thereon. A conductive barrier layer may be formed on a first portion of the metal pad, and a second exposed portion of the metal pad may be free of the conductive barrier layer. In addition, an interconn...
Saved in:
| Main Author | |
|---|---|
| Format | Patent |
| Language | English French |
| Published |
05.01.2006
|
| Edition | 7 |
| Subjects | |
| Online Access | Get full text |
Cover
Loading…
| Abstract | A method of forming an electronic structure may include providing a substrate having a metal pad thereon. A conductive barrier layer may be formed on a first portion of the metal pad, and a second exposed portion of the metal pad may be free of the conductive barrier layer. In addition, an interconnection structure may be provided on the conductive barrier layer with the conductive barrier layer being between the interconnection structure and the metal pad. Moreover, the interconnection structure and the conductive barrier layer may include different materials. Related structures are also discussed.
L'invention concerne un procédé de formation de structure électronique qui peut comprendre les étapes suivantes : fourniture de substrat à plage métallique ; formation de couche barrière conductrice sur une première partie de plage, une seconde partie exposée de plage étant libre de cette couche ; et par ailleurs, établissement de structure d'interconnexion sur la couche barrière conductrice, cette couche se trouvant entre la structure d'interconnexion et la plage métallique. Enfin, la structure d'interconnexion et la couche barrière conductrice peuvent comprendre différents matériaux. L'invention concerne également des structures connexes. |
|---|---|
| AbstractList | A method of forming an electronic structure may include providing a substrate having a metal pad thereon. A conductive barrier layer may be formed on a first portion of the metal pad, and a second exposed portion of the metal pad may be free of the conductive barrier layer. In addition, an interconnection structure may be provided on the conductive barrier layer with the conductive barrier layer being between the interconnection structure and the metal pad. Moreover, the interconnection structure and the conductive barrier layer may include different materials. Related structures are also discussed.
L'invention concerne un procédé de formation de structure électronique qui peut comprendre les étapes suivantes : fourniture de substrat à plage métallique ; formation de couche barrière conductrice sur une première partie de plage, une seconde partie exposée de plage étant libre de cette couche ; et par ailleurs, établissement de structure d'interconnexion sur la couche barrière conductrice, cette couche se trouvant entre la structure d'interconnexion et la plage métallique. Enfin, la structure d'interconnexion et la couche barrière conductrice peuvent comprendre différents matériaux. L'invention concerne également des structures connexes. |
| Author | MIS, J. DANIEL |
| Author_xml | – fullname: MIS, J. DANIEL |
| BookMark | eNrjYmDJy89L5WTw8XUN8fB3CVbwd1Nw8w_y9fRzVwj293FxDVJwCvUNAIr7KbhGBPgHu7ooAJU6-igEOAJVO_q5KAS5-jiGAIWDQ4JCnUNCg1yDeRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfLi_kYGBqaGBoYmlpaOxMXGqAJchMJY |
| ContentType | Patent |
| DBID | EVB |
| DatabaseName | esp@cenet |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Medicine Chemistry Sciences |
| DocumentTitleAlternate | PROCEDES DE FORMATION DE BOSSAGE DE SOUDURE SUR PLAGES METALLIQUES EXPOSEES ET STRUCTURES CONNEXES |
| Edition | 7 |
| ExternalDocumentID | WO2005101499A3 |
| GroupedDBID | EVB |
| ID | FETCH-epo_espacenet_WO2005101499A33 |
| IEDL.DBID | EVB |
| IngestDate | Fri Jul 19 15:04:55 EDT 2024 |
| IsOpenAccess | true |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | English French |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-epo_espacenet_WO2005101499A33 |
| Notes | Application Number: WO2005US12029 |
| OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060105&DB=EPODOC&CC=WO&NR=2005101499A3 |
| ParticipantIDs | epo_espacenet_WO2005101499A3 |
| PublicationCentury | 2000 |
| PublicationDate | 20060105 |
| PublicationDateYYYYMMDD | 2006-01-05 |
| PublicationDate_xml | – month: 01 year: 2006 text: 20060105 day: 05 |
| PublicationDecade | 2000 |
| PublicationYear | 2006 |
| RelatedCompanies | UNITIVE INTERNATIONAL LIMITED MIS, J. DANIEL |
| RelatedCompanies_xml | – name: MIS, J. DANIEL – name: UNITIVE INTERNATIONAL LIMITED |
| Score | 2.6268945 |
| Snippet | A method of forming an electronic structure may include providing a substrate having a metal pad thereon. A conductive barrier layer may be formed on a first... |
| SourceID | epo |
| SourceType | Open Access Repository |
| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | METHODS OF FORMING SOLDER BUMPS ON EXPOSED METAL PADS AND RELATED STRUCTURES |
| URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060105&DB=EPODOC&locale=&CC=WO&NR=2005101499A3 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1bS8MwFD7MKeqbTmXqlIDStyL2ovZhSNekVlmbsrbat9ErCNINV_HvexK2uae9hSQcksB3LknOdwBuS7Thmm7WqpZlmWoU97pqoVuqmjUa57qszTwTycl-8OAlxltqph34WuXCSJ7QX0mOiIgqEO-t1Nfz_0ssKv9WLu7yT-yaPbvxkCrr6FgUfFToaMhCTrmjOA7GbUowkYyboiytZdn6DuwKR1ow7bP3kchLmW8aFfcI9kKU17TH0KmaHhw4q9prPdj3l0_e2Fyib3ECY5_FHqcR4S7B4M1_DV5IxMeUTcgo8UPsDwhLQx4xSnCqPSahjbPtgBJRGQN1FIniSeKInw7RKdy4LHY8FZc1XZ_C9INv7kE_g24za6o-EC1_LATxXF3qlpE9ZblmlAX6ZQheE_FYncNgm6SL7cOXcLi-dTAH0G2_f6ortMNtfi2P7w_H-YRC |
| link.rule.ids | 230,309,786,891,25594,76906 |
| linkProvider | European Patent Office |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1bS8MwFD7MKc43nYqXqQGlb0XsxdmHIW3T2mnblLXTvZVeQZBuuIp_35Oy1T3tLSThkAS-c0lyvgNwl6MNl2S1FKUkSUQle5BFDd1SUS3ROJd5qaYJT072_EdnqrzO1FkHvta5MA1P6G9DjoiIyhDvdaOvF_-XWLT5W7m8Tz-xa_5sRyMqtNExL_goUGNkBYwyUzBNjNsEf9IwbvKytJqmyzuwO-T8vNx5ejd4Xspi06jYh7AXoLyqPoJOUfWhZ65rr_Vh31s9eWNzhb7lMbieFTmMhoTZBIM3b-y_kJC51JoQY-oF2O8Taxaw0KIEp-ouCXScrfuU8MoYqKNIGE2mJv_pEJ7ArW1FpiPisuL2FOIPtrkH-RS61bwqzoBI6TDjxHNlLmtK8pSkkpJn6JcheFXEY3EOg22SLrYP30DPiTw3dsf-2yUctDcQ6gC69fdPcYU2uU6vm6P8AyBkhy8 |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=METHODS+OF+FORMING+SOLDER+BUMPS+ON+EXPOSED+METAL+PADS+AND+RELATED+STRUCTURES&rft.inventor=MIS%2C+J.+DANIEL&rft.date=2006-01-05&rft.externalDBID=A3&rft.externalDocID=WO2005101499A3 |