METHODS OF FORMING SOLDER BUMPS ON EXPOSED METAL PADS AND RELATED STRUCTURES

A method of forming an electronic structure may include providing a substrate having a metal pad thereon. A conductive barrier layer may be formed on a first portion of the metal pad, and a second exposed portion of the metal pad may be free of the conductive barrier layer. In addition, an interconn...

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Bibliographic Details
Main Author MIS, J. DANIEL
Format Patent
LanguageEnglish
French
Published 05.01.2006
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of forming an electronic structure may include providing a substrate having a metal pad thereon. A conductive barrier layer may be formed on a first portion of the metal pad, and a second exposed portion of the metal pad may be free of the conductive barrier layer. In addition, an interconnection structure may be provided on the conductive barrier layer with the conductive barrier layer being between the interconnection structure and the metal pad. Moreover, the interconnection structure and the conductive barrier layer may include different materials. Related structures are also discussed. L'invention concerne un procédé de formation de structure électronique qui peut comprendre les étapes suivantes : fourniture de substrat à plage métallique ; formation de couche barrière conductrice sur une première partie de plage, une seconde partie exposée de plage étant libre de cette couche ; et par ailleurs, établissement de structure d'interconnexion sur la couche barrière conductrice, cette couche se trouvant entre la structure d'interconnexion et la plage métallique. Enfin, la structure d'interconnexion et la couche barrière conductrice peuvent comprendre différents matériaux. L'invention concerne également des structures connexes.
Bibliography:Application Number: WO2005US12029