METHOD FOR PROCESSING SUBSTRATE, CATALYST PROCESS LIQUID, AND SUBSTRATE PROCESSING APPARATUS

• Main Authors: SAHODA, TSUYOSHI, TAKAGI, DAISUKE, FUKUNAGA, YUKIO, WANG, XINMING, TASHIRO, AKIHIKO, FUKUNAGA, AKIRA, NISHIOKA, YUKIKO, OWATARI, AKIRA
• Format: Patent
• Language: English; French; Japanese
• Published: 04.08.2005
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

Disclosed is a method for processing a substrate with improved throughput which enables to surely form a metal film on an exposed surface of an underlying metal such as wiring by nonelectrolytic plating without causing a void inside the underlying metal. In this method, the surface of a substrate on which an underlying metal is formed is cleaned with a cleaning liquid which is obtained by adding a surfactant into an organic acid having a carboxyl group or an aqueous solution of its salt; the cleaned surface of the substrate is brought into contact with a process liquid which is obtained by mixing the cleaning liquid with a solution containing metal catalyst ions, thereby applying the catalyst onto the substrate surface; and a metal film is formed over the substrate surface, to which the catalyst has been applied, through nonelectrolytic plating. La présente invention concerne un procédé de traitement de substrat à rendement amélioré qui permet de former de manière sûre un film métallique sur une surface exposée d'un métal sous-jacent tel qu'un câblage par placage non électrolytique sans entraîner un vide à l'intérieur de ce métal sous-jacent. Dans ce procédé, la surface d'un substrat sur lequel un métal sous-jacent est formé est nettoyée avec un liquide de nettoyage obtenu par l'addition d'un tensioactif dans un acide organique possédant un groupe carboxyle ou d'une solution aqueuse de ses sels. Cette surface nettoyée de substrats est mise en contact avec un liquide de processus qui est obtenu par le mélange du liquide de nettoyage avec une solution contenant des ions catalytiques de métal, appliquant ce catalyseur sur la surface du substrat et, un film métallique est formé sur la surface du substrat, sur laquelle le catalyseur a été appliqué, par un placage non électrolytique.