DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER ELECTRONIC COMPONENT
[PROBLEMS] Conventional dielectric porcelain compositions for high-frequency applications involve such a problem that a structural defect may occur due to the difference in thermal shrinkage between the adhesive layer and the ceramic layer since the firing temperature is too high and the manufacturi...
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Main Authors | , |
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Format | Patent |
Language | English French Japanese |
Published |
30.06.2005
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | [PROBLEMS] Conventional dielectric porcelain compositions for high-frequency applications involve such a problem that a structural defect may occur due to the difference in thermal shrinkage between the adhesive layer and the ceramic layer since the firing temperature is too high and the manufacturing process of a multilayer capacitor is complicated. Consequently, it has been difficult to realize a small-sized and many-layered multilayer ceramic capacitor. [MEANS FOR SOLVING PROBLEMS] Disclosed is a dielectric ceramic composition represented by the following general formula: MgxSiO2+x + aSryTiO2+y, wherein x, y and a respectively satisfy 1.70 <= x <=1.99, 0.98 <= y <= 1.02 and 0.05 <= a <= 0.40.
Les compositions de porcelaine diélectriques classiques pour applications haute fréquence présentent un inconvénient: un défaut structural peut se produire à cause de la différence de retrait thermique entre la couche adhésive et la couche céramique étant donné que la température de cuisson est trop élevée et que le procédé de fabrication d'un condensateur multicouche est complexe. Par conséquent, il est difficile de fabriquer un condensateur céramique multicouche de petite taille. L'invention concerne une composition de céramique diélectrique représentée par la formule générale MgxSiO2+x + aSryTiO2+y, dans laquelle x, y et a satisfont respectivement aux équations suivantes: 1,70 </= x </= 1,99, 0,98 </= y </= 1,02, et 0,05 </= a </= 0,40. |
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Bibliography: | Application Number: WO2004JP18468 |