CHIP TYPE LED

A chip type LED comprises an insulating substrate (12), a light emitting diode chip (15) mounted on the upper surface thereof, and a transparent package body (16) provided on the upper surface of the insulating substrate to seal the light emitting diode chip hermetically. The chip type LED is made t...

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Bibliographic Details
Main Author ITAI, JUNICHI
Format Patent
LanguageEnglish
French
Japanese
Published 31.03.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A chip type LED comprises an insulating substrate (12), a light emitting diode chip (15) mounted on the upper surface thereof, and a transparent package body (16) provided on the upper surface of the insulating substrate to seal the light emitting diode chip hermetically. The chip type LED is made thin when the light emitting diode chip is arranged to emit light laterally. The light emitting diode chip (15) is mounted on the upper surface of the insulating substrate while directing the anode electrode (15f) downward and directing the cathode electrode (15a) upward. L'invention décrit une DEL de type puce qui comprend un substrat isolant (12), une puce de diode électroluminescente (15) qui surmonte la surface supérieure du substrat, ainsi qu'un couvercle transparent (16) qui recouvre la surface supérieure du substrat isolant pour fermer hermétiquement la puce de la diode électroluminescente. La DEL de type puce est affinée lorsque la puce de diode électroluminescente est disposée pour émettre la lumière latéralement. La puce de diode électroluminescente (15) est montée sur la surface supérieure du substrat isolant, l'anode (15f) étant orientée vers le bas et la cathode vers le haut (15a).
Bibliography:Application Number: WO2004JP07932