A POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING

The present invention provides in one embodiment, a polishing pad (100) for chemical mechanical polishing. The polishing pad comprises a polishing body (110). The polishing body comprises a thermoplastic foam substrate (115) having a surface (120) comprising concave cells (125). A polishing agent (1...

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Bibliographic Details
Main Author OBENG, YAW, S
Format Patent
LanguageEnglish
French
Published 31.03.2005
Edition7
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Summary:The present invention provides in one embodiment, a polishing pad (100) for chemical mechanical polishing. The polishing pad comprises a polishing body (110). The polishing body comprises a thermoplastic foam substrate (115) having a surface (120) comprising concave cells (125). A polishing agent (130) coats an interior surface (135) of the concave cells. The polishing agent comprises an inorganic metal oxide that includes carbides or nitrides. Yet another embodiment of the present invention is a method for preparing a polishing pad (200). Dans un mode de réalisation, la présente invention a trait à un tampon à polir (100) pour le polissage mécano-chimique. Le tampon à polir comporte un corps de polissage (110). Le corps de polissage comporte un substrat en mousse thermoplastique (115) présentant une surface (120) comprenant des cellules concaves (125). Un agent de polissage (130) est revêtu sur une surface intérieure (135) des cellules concaves. L'agent de polissage comporte un oxyde métallique inorganique comprenant des carbures et des nitrures. Dans un autre mode de réalisation, la présente invention a trait à un procédé de préparation d'un tampon à polir (200).
Bibliography:Application Number: WO2004US30013