METHOD OF MANUFACTURING MULTI-LEVEL CONTACTS BY SIZING OF CONTACT SIZES IN INTEGRATED CIRCUITS

• Main Authors: HELLIG, KAY, AMINPUR, MASSUD
• Format: Patent
• Language: English; French
• Published: 10.02.2005
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INFORMATION STORAGE; PHYSICS; SEMICONDUCTOR DEVICES; STATIC STORES

A method [600] for forming an integrated circuit includes etching a first opening [228] [338] [402] to a first depth in a dielectric material [322] over a semiconductor device [317] on a first semiconductor substrate [202] and etching a second opening [230] [340] [404] to a second depth in the diele...