RESIN COMPOSITION AND ADHESIVE FILM
A resin composition excellent in hygroscopicity, thermal resistance, adhesion, electric characteristics and moldability and suitable for use as an insulating material for multilayer wiring boards and electric components; and adhesive films. The resin composition comprises (A) a polymer having a quin...
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Main Authors | , , , , , , , , |
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Format | Patent |
Language | English French Japanese |
Published |
11.11.2004
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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