RESIN COMPOSITION AND ADHESIVE FILM
A resin composition excellent in hygroscopicity, thermal resistance, adhesion, electric characteristics and moldability and suitable for use as an insulating material for multilayer wiring boards and electric components; and adhesive films. The resin composition comprises (A) a polymer having a quin...
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Main Authors | , , , , , , , , |
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Format | Patent |
Language | English French Japanese |
Published |
11.11.2004
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Abstract | A resin composition excellent in hygroscopicity, thermal resistance, adhesion, electric characteristics and moldability and suitable for use as an insulating material for multilayer wiring boards and electric components; and adhesive films. The resin composition comprises (A) a polymer having a quinoline ring of the general formula (1) in a structure of, for example, 6,6'-bis(2-(4- fluorophenyl)-4-phenylquinoline) or 4,4'-(1,1,1,3,3,3-hexafluoro-2,2-propylidene) bisphenol and (B) a bismaleimide compound of the general formula (2), such as 2,2-bis((4-maleimidophenoxy) phenyl)propane.
L'invention concerne une composition à base de résine à hygroscopicité, résistance thermique, adhésion, caractéristiques électriques et moulabilité excellentes qui convient en tant que matériau isolant dans des panneaux de câblage multicouche et des composants électriques. L'invention concerne également des films adhésifs. La composition à base de résine comprend : (A) un polymère possédant un noyau de quinoline représenté par la formule générale (1) dans une structure de, par exemple, 6,6'-bis(2-(4-fluorophényl)-4-phénylquinoline) ou de 4,4'-(1,1,1,3,3,3-hexafluoro-2,2-propylidène)bisphénol et (B) un composé bismaléimide représenté par la formule générale (2), tel que 2,2-bis((4-maléimidophénoxy)phényl)propane. |
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AbstractList | A resin composition excellent in hygroscopicity, thermal resistance, adhesion, electric characteristics and moldability and suitable for use as an insulating material for multilayer wiring boards and electric components; and adhesive films. The resin composition comprises (A) a polymer having a quinoline ring of the general formula (1) in a structure of, for example, 6,6'-bis(2-(4- fluorophenyl)-4-phenylquinoline) or 4,4'-(1,1,1,3,3,3-hexafluoro-2,2-propylidene) bisphenol and (B) a bismaleimide compound of the general formula (2), such as 2,2-bis((4-maleimidophenoxy) phenyl)propane.
L'invention concerne une composition à base de résine à hygroscopicité, résistance thermique, adhésion, caractéristiques électriques et moulabilité excellentes qui convient en tant que matériau isolant dans des panneaux de câblage multicouche et des composants électriques. L'invention concerne également des films adhésifs. La composition à base de résine comprend : (A) un polymère possédant un noyau de quinoline représenté par la formule générale (1) dans une structure de, par exemple, 6,6'-bis(2-(4-fluorophényl)-4-phénylquinoline) ou de 4,4'-(1,1,1,3,3,3-hexafluoro-2,2-propylidène)bisphénol et (B) un composé bismaléimide représenté par la formule générale (2), tel que 2,2-bis((4-maléimidophénoxy)phényl)propane. |
Author | IIOKA, SHINJI KAGEYAMA, AKIRA SUZUKI, MASAO NOMURA, YOSHIHIRO SUZUKI, MASAHIRO KAWAI, TOSHIYASU NISHIMURA, SHIN TAKAHASHI, AKIO HONDA, YOSHIHIKO |
Author_xml | – fullname: SUZUKI, MASAHIRO – fullname: HONDA, YOSHIHIKO – fullname: NOMURA, YOSHIHIRO – fullname: TAKAHASHI, AKIO – fullname: KAGEYAMA, AKIRA – fullname: IIOKA, SHINJI – fullname: NISHIMURA, SHIN – fullname: SUZUKI, MASAO – fullname: KAWAI, TOSHIYASU |
BookMark | eNrjYmDJy89L5WRQDnIN9vRTcPb3DfAP9gzx9PdTcPRzUXB08QCKh7kquHn6-PIwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvhwfyMDAxMDSzNLQ0tHQ2PiVAEAyQ8lYQ |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
DocumentTitleAlternate | COMPOSITION A BASE DE RESINE ET FILM ADHESIF |
Edition | 6 |
ExternalDocumentID | WO2004096919A1 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_WO2004096919A13 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 11:49:25 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English French Japanese |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_WO2004096919A13 |
Notes | Application Number: WO1998JP01587 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20041111&DB=EPODOC&CC=WO&NR=2004096919A1 |
ParticipantIDs | epo_espacenet_WO2004096919A1 |
PublicationCentury | 2000 |
PublicationDate | 20041111 |
PublicationDateYYYYMMDD | 2004-11-11 |
PublicationDate_xml | – month: 11 year: 2004 text: 20041111 day: 11 |
PublicationDecade | 2000 |
PublicationYear | 2004 |
RelatedCompanies | IIOKA, SHINJI KAGEYAMA, AKIRA SUZUKI, MASAO NOMURA, YOSHIHIRO SUZUKI, MASAHIRO KAWAI, TOSHIYASU NISHIMURA, SHIN TAKAHASHI, AKIO HONDA, YOSHIHIKO |
RelatedCompanies_xml | – name: NISHIMURA, SHIN – name: TAKAHASHI, AKIO – name: KAGEYAMA, AKIRA – name: IIOKA, SHINJI – name: NOMURA, YOSHIHIRO – name: HONDA, YOSHIHIKO – name: SUZUKI, MASAHIRO – name: SUZUKI, MASAO – name: KAWAI, TOSHIYASU |
Score | 2.6916966 |
Snippet | A resin composition excellent in hygroscopicity, thermal resistance, adhesion, electric characteristics and moldability and suitable for use as an insulating... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP |
Title | RESIN COMPOSITION AND ADHESIVE FILM |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20041111&DB=EPODOC&locale=&CC=WO&NR=2004096919A1 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQMU6zNDFOSzHSNUg2SNU1SUoy1U0C9gp0U5JSU00tgFVqCvhKFl8_M49QE68I0wgmhhzYXhjwOaHl4MMRgTkqGZjfS8DldQFiEMsFvLayWD8pEyiUb-8WYuuiBusdm4BKADUXJ1vXAH8Xf2c1Z2dgv03NLwgsB2ytWxpaOgL7SqyghjTopH3XMCfQvpQC5ErFTZCBLQBoXl6JEANTVqIwA6cz7O41YQYOX-iUN5AJzX3FIgzKwNDy9FNw9vcN8A_2BI0tKTj6uSg4ungAxcNcFdw8fXxFGZTdXEOcPXSBtsXDPRcf7o_sNGMxBhZgtz9VgkHBwBI0RWeZapGabGaSbGFimZSYbGlmDvKiJbCflCLJIIPPJCn80tIMXJAjCw2BSIaBpaSoNFUWWL2WJMmBQwUAJR14zA |
link.rule.ids | 230,309,786,891,25594,76906 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LS8NAEB5KFetNq-KjaqCSWzA1j2YPRdI8SDQvNNbeQjfZgiJabMS_7-zaaE-FPSw7sI-B2ZlvZ2cG4EqbE12bVzeKWqpM0Sk1FIqoQKkoY4aFKrUSJVnixAye9LupMW3BWxMLI_KEfovkiChRJcp7Le7rxf8jliv-Vi6v6QsOfdz6-ciVG3Ss8xtAdscjL0vd1JEdB3GbnDwIGlrrZEBsxEpbQ56flxtPkzGPS1msKxV_D7YznO-93ofW66wLHaepvdaFnXjl8sbuSvqWB9BHboWJ5KRxlj6G_G1JshNXst0Axyee5IdRfAh938udQMHVir_DFc_p-ta0I2gj7GfHIKmEu-gIs1hp6qWlEzoriTnkRySIk6oT6G2a6XQz-RI6QR5HRRQm92ew-5u-cICtB-3684udo6qt6YXg0A_zl3u5 |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=RESIN+COMPOSITION+AND+ADHESIVE+FILM&rft.inventor=SUZUKI%2C+MASAHIRO&rft.inventor=HONDA%2C+YOSHIHIKO&rft.inventor=NOMURA%2C+YOSHIHIRO&rft.inventor=TAKAHASHI%2C+AKIO&rft.inventor=KAGEYAMA%2C+AKIRA&rft.inventor=IIOKA%2C+SHINJI&rft.inventor=NISHIMURA%2C+SHIN&rft.inventor=SUZUKI%2C+MASAO&rft.inventor=KAWAI%2C+TOSHIYASU&rft.date=2004-11-11&rft.externalDBID=A1&rft.externalDocID=WO2004096919A1 |