METHOD FOR FORMING A COATING FILM

• Main Authors: KOMATSUBARA, MAKOTO, KONDOU, SEIJI, TSUCHIMOTO, KAZUKI, FUJITA, YUTAKA, INOUE, RYUUICHI, OOTA, MIE
• Format: Patent
• Language: English; French; Japanese
• Published: 28.10.2004
• Edition: 7
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PHYSICS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SPRAYING OR ATOMISING IN GENERAL; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

The invention relates to formation of a coating film, and a method for forming a coating film having small variations in thickness is disclosed. In a method wherein a coating film (11) is formed by applying a coating liquid onto a continuously-moving long support (10), it is used such a coating liquid that the surface tension of the coating liquid changes according to the changes in the solute concentration while having the minimum value at a certain concentration, and that the solute concentration is adjusted within ± 10 weight% of the above-mentioned certain concentration. L'invention se rapporte à la formation d'un film de revêtement, et à un procédé de formation d'un film de revêtement présentant de faibles variations d'épaisseur. Dans un procédé selon lequel un film de revêtement (11) est formé par application d'un liquide de revêtement sur un support long et continuellement en déplacement (10), le liquide de revêtement utilisé est tel que la tension superficielle de ce liquide de revêtement change en fonction des modifications de la concentration du soluté, ladite tension ayant sa valeur minimale pour une concentration donnée, et la concentration du soluté étant ajustée à l'intérieur d'une plage de < 10 % en poids de la concentration donnée mentionnée ci-dessus.