MOUNTING METHOD AND MOUNTING SYSTEM

• Main Authors: YAMAUCHI, AKIRA, NARABA, SATORU
• Format: Patent
• Language: English; French; Japanese
• Published: 06.11.2003
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

A mounting method and a mounting system characterized in that articles being bonded are disposed oppositely, and after the bonding face of the upper article directing downward is cleaned with energy wave or energy particles, the bonding face of the lower article directing upward is cleaned, or both articles are disposed oppositely and the opposite bonding faces are cleaned or they are cleaned while inserting a partition plate between both articles. When bonding faces of the articles are cleaned prior to bonding, contaminants removed from the bonding face are prevented effectively from readhering to the bonding face and highly reliable bonding is ensured by enhancing the cleaning effect. L'invention porte sur un procédé et un système d'assemblage de deux pièces se faisant face. Après avoir nettoyé la surface tournée vers le bas de la première pièce à l'aide d'ondes ou de particules énergétiques, on nettoie de même la surface tournée vers le haut de la deuxième pièce, avant ou après insertion entre elles d'une plaque de séparation. Ce nettoyage effectué avant assemblage empêche que les contaminants éliminés de la surface d'assemblage n'y réadhèrent, ce qui garantit la fiabilité de l'assemblage.