THINNER COMPOSITION FOR REMOVING PHOTOSENSITIVE RESIN
The present invention relates to a thinner composition for removing photosensitive resin, which is used in manufacture processes of semiconductor devices and liquid crystal display devices. The present invention provides a thinner composition comprising propyleneglycol monoalkyl ether acetate, cyclo...
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Main Authors | , , |
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Format | Patent |
Language | English French |
Published |
09.10.2003
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | The present invention relates to a thinner composition for removing photosensitive resin, which is used in manufacture processes of semiconductor devices and liquid crystal display devices. The present invention provides a thinner composition comprising propyleneglycol monoalkyl ether acetate, cycloketone, polyethylene based condensate and fluorinated acrylic copolymer.
L'invention concerne une composition de diluant, destinée à l'élimination de résine photosensible utilisée dans les procédés de fabrication de dispositifs semi-conducteurs et de dispositifs d'affichage à cristaux liquides. Cette composition comprend un monoalkylétheracétate de propylèneglycol, une cyclocétone, un condensat à base de polyéthylène et un copolymère acrylique fluoré. |
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Bibliography: | Application Number: WO2003KR00632 |