THERMAL MANAGEMENT WITH FILLED POLYMERIC POLISHING PADS AND APPLICATIONS THEREFOR
The present invention is directed, in general, to a method of planarizing a surface on a semiconductor wafer and, more specifically, to a method of altering the properties of polishing pads to improve thermal management during chemical-mechanical planarization, the resulting heat conductive pad and...
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Main Authors | , |
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Format | Patent |
Language | English French |
Published |
25.09.2003
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | The present invention is directed, in general, to a method of planarizing a surface on a semiconductor wafer and, more specifically, to a method of altering the properties of polishing pads to improve thermal management during chemical-mechanical planarization, the resulting heat conductive pad and a polishing apparatus that includes the pad. The pad includes a polishing body composed of a thermoconductive polymer comprising an substrate and filler particle containing a Group II salt and within the substrate.
La présente invention concerne, de manière générale, un procédé de planarisation d'une surface sur une plaquette à semi-conducteurs et, plus particulièrement, un procédé de modification des propriétés de tampons de polissage pour améliorer la gestion thermique au cours de la planarisation chimio-mécanique, le tampon thermoconducteur ainsi obtenu et un appareil de polissage qui comprend ledit tampon. Ledit tampon comprend un corps de polissage constitué d'un polymère thermoconducteur présentant un substrat à particules de charge contenant un sel du groupe II. |
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Bibliography: | Application Number: WO2002US35000 |