HEAT RELEASED ENCAPSULATED YEAST

The present invention is an encapsulated yeast composite comprising a core comprising yeast and a coating which comprises a low melting point lipid which melts at a temperature not greater than 95°F. The yeast includes Saccharomyces cerevisiae. The encapsulated composites are useful in the productio...

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Bibliographic Details
Main Authors MARTIN, DAVID, E, PACIFICO, CARL, J, DALLY, VERNETTA, L, RICHARDSON, PAUL, H
Format Patent
LanguageEnglish
French
Published 25.09.2003
Edition7
Subjects
BAKERY PRODUCTS
BAKING
EDIBLE DOUGHS
HUMAN NECESSITIES
PRESERVATION THEREOF
TREATMENT, e.g. PRESERVATION, OF FLOUR OR DOUGH, e.g. BYADDITION OF MATERIALS
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Summary:The present invention is an encapsulated yeast composite comprising a core comprising yeast and a coating which comprises a low melting point lipid which melts at a temperature not greater than 95°F. The yeast includes Saccharomyces cerevisiae. The encapsulated composites are useful in the production of food compositions and food products. La présente invention concerne un composite de levure encapsulée comprenant un noyau constitué de levure et un enrobage qui comprend un lipide à point de fusion bas qui fond à partir d'une température de 95 DEG F. La levure comprend des saccharomyces cerevisiae. Les composites encapsulés sont utiles pour la production de compositions alimentaires et de produits alimentaires.
Bibliography:Application Number: WO2003US07807