POLISHING METHOD AND POLISHING FLUID

• Main Authors: WADA, YUTAKA, SASAKI, TATSUYA, HAGIHARA, TOSHIYA, AKATSUKA, TOMOHIKO
• Format: Patent
• Language: English; French; Japanese
• Published: 28.08.2003
• Edition: 7
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DRESSING OR CONDITIONING OF ABRADING SURFACES; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PERFORMING OPERATIONS; POLISHES; POLISHING; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SEMICONDUCTOR DEVICES; SKI WAXES; TRANSPORTING

A method for polishing wherein an article is polished by the thrust thereof on fixed abrasive grains with sliding, characterized in that it comprises a first step of polishing the article to be polished while feeding a polishing fluid which contains an anionic surfactant and no abrasive grains. The method can be advantageously employed for polishing an article to be polished, such as a semiconductor wafer, using fixed abrasive grains. Cette invention se rapporte à un procédé de polissage, grâce auquel on effectue le polissage d'un article en le poussant contre des particules abrasives fixes tout en le faisant glisser, ce procédé se caractérisant en ce qu'il comprend une première étape consistant à effectuer le polissage de l'article à polir avec l'apport d'un fluide de polissage qui contient un tensioactif anionique mais pas de particules abrasives. Ce procédé peut être utilisé avantageusement pour effectuer le polissage d'un article à polir, tel qu'une plaquette de semi-conducteur, en utilisant des particules abrasives fixes.