PRINTED CIRCUIT BOARD RECYCLE METHOD AND APPARATUS THEREOF

• Main Authors: NAKAMURA, KATSUMI, SAKAIDA, ATSUSI, KAMIMURA, RIKIYA, KONDO, KOUJI, TANIGUCHI, TOSHIHISA
• Format: Patent
• Language: English; French; Japanese
• Published: 26.06.2003
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATERTREATMENT OR WASTE MANAGEMENT; DISPOSAL OF SOLID WASTE; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; MAKING GRANULES OR PREFORMS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PERFORMING OPERATIONS; PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED; PRETREATMENT OF RAW MATERIALS; PRINTED CIRCUITS; PRODUCTION AND REFINING OF METALS; RECLAMATION OF CONTAMINED SOIL SOIL; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

A printed circuit board recycle method and apparatus thereof capable of separately collecting a metal material including wiring metal material and an insulation material constituting a printed circuit board and reutilizing the collected wiring metal material and the insulation material. Among the processes related to the recycle method of the printed circuit board, in a heating/filtration step (P400), by using a heating/filtration apparatus (4a) or a resin-metal separation apparatus (51), a printed circuit board (1) to be discarded is heated and forcibly filtrated, so that only the insulation material (1a) is passed, thereby isolating the insulation material (1a) from the metal material (1b). It should be noted that a printed circuit board substrate (100) having an insulation substrate (23) formed by a thermo-plastic resin or a mixture of a thermo-plastic resin and an inorganic filling material is applied to the printed circuit board to be discarded. Thus, when the collection amounts of the both have reached the amounts necessary for reutilization, the both can be reutilized. L'invention concerne un procédé de recyclage de cartes de circuit imprimé et un appareil correspondant, en mesure de collecter séparément un matériau métallique comprenant un matériau métallique de câblage et un matériau isolant constituant une carte de circuit imprimé, et de réutiliser lesdits matériaux de câblage et isolants collectés. Dans les procédés ayant trait au recyclage des cartes de circuit imprimé, mettant en oeuvre une étape de chauffage/filtration (P400) au moyen d'un appareil de chauffage/filtration (4a) ou un appareil de séparation résine-métal (51), une carte de circuit imprimé (1) à jeter au rebut est chauffée puis soumise à une filtration forcée, de façon à ne laisser passer que le matériau isolant (1a), séparant ainsi ce matériau (1a) du matériau métallique (1b). Il convient de noter qu'un substrat de carte de circuit imprimé (100) ayant un substrat isolant (23) formé d'une résine thermoplastique ou d'un mélange de résine thermoplastique et d'une charge inorganique est appliqué sur la carte de circuit imprimé à jeter. Il s'ensuit que lorsque les quantités collectées des deux produits ont atteint les quantités requises pour la réutilisation, les deux produits peuvent être réutilisés.