DEVICE AND METHOD FOR VACUUM DEPOSITION, AND ORGANIC ELECTROLUMINESCENT ELEMENT PROVIDED BY THE DEVICE AND THE METHOD

• Main Authors: KIDO, JUNJI, NAKAGAWA, TERUO, YANAGI, YUUJI, KONDO, YUKIHIRO, NISHIMORI, TAISUKE, MATSUMOTO, EIICHI, MAKI, SYUUJI, KISHI, YASUO
• Format: Patent
• Language: English; French; Japanese
• Published: 01.05.2003
• Edition: 7
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A vacuum deposition device, wherein an evaporation source (2) and a deposited body (3) are disposed in a vacuum chamber (1) and a space between the evaporation source (2) and the deposited body (3) is surrounded by a tubular body (4) heated at a temperature for vaporizing the substances of the evaporation source so that the substances vaporized from the evaporation source (2) can reach the surface of the deposited body (3) through the inside of the tubular body (4) and then be deposited thereon, and a control member (8) for controllably guiding the movement of the vaporized substances to the deposited body (3) inside the tubular body (4) is installed in the tubular body (4), whereby the distribution of the vaporized substances adhered onto the deposited body can be controlled so that deposition with uniform film thickness can be performed on the deposited body and, as the case may be, the deposition can be performed with an intentionally set film thickness distribution. A vacuum deposition device, wherein an evaporation source 2 and a deposited body 3 are disposed in a vacuum chamber 1 and a space between the evaporation source 2 and the deposited body 3 is surrounded by a tubular body 4 heated at a temperature for vaporizing the substances of the evaporation source so that the substances vaporized from the evaporation source 2 can reach the surface of the deposited body 3 through the inside of the tubular body 4 and then be deposited thereon, and a control member 8 for controllably guiding the movement of the vaporized substances to the deposited body 3 inside the tubular body 4 is installed in the tubular body 4, whereby the distribution of the vaporized substances adhered onto the deposited body can be controlled so that deposition with uniform film thickness can be performed on the deposited body and, as the case may be, the deposition can be performed with an intentionally set film thickness distribution. L'invention concerne un dispositif de métallisation sous vide. Le dispositif selon l'invention comprend une source d'évaporation (2) et un corps déposé (3) disposés dans une chambre à vide (1), un espace entre la source d'évaporation (2) et le corps déposé (3) étant entouré par un corps tubulaire (4) chauffé à une température permettant la vaporisation de substances de la source d'évaporation, de sorte que ces substances vaporisées peuvent atteindre la surface du corps déposé (3) par l'intérieur du corps tubulaire (4) et être ensuite déposées sur cette surface. Ce dispositif comprend également un élément de commande (8) permettant de guider de manière réglable le mouvement des substances vaporisées vers le corps déposé (3), à l'intérieur du corps tubulaire (4), cet élément étant monté dans le corps tubulaire (4), la répartition des substances vaporisées adhérées sur le corps déposé pouvant être commandée pour que le dépôt présente une épaisseur de film uniforme et, le cas échéant, que l'épaisseur du film puisse être déterminée.