WIRING BOARD, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THEM

A wiring board comprising an insulating basic material, a wiring provided on one of the front surface or rear surface thereof, and a conductor member buried in the insulating basic material, wherein the conductor member has one end exposed to the surface of the insulating basic material and connecte...

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Main Authors WAKASHIMA, YOSHIAKI, SHIMADA, OSAMU, FUKUTOMI, NAOKI, SUZUKI, KAZUHISA, TAKEUCHI, KAZUMASA, OKIKAWA, SUSUMU
Format Patent
LanguageEnglish
French
Japanese
Published 13.03.2003
Edition7
Subjects
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Summary:A wiring board comprising an insulating basic material, a wiring provided on one of the front surface or rear surface thereof, and a conductor member buried in the insulating basic material, wherein the conductor member has one end exposed to the surface of the insulating basic material and connected with the wiring and the other end buried in the insulating basic material. A semiconductor device employing the wiring board and a method for producing them. A wiring board comprising an insulating basic material, a wiring provided on one of the front surface or rear surface thereof, and a conductor member buried in the insulating basic material, wherein the conductor member has one end exposed to the surface of the insulating basic material and connected with the wiring and the other end buried in the insulating basic material. A semiconductor device employing the wiring board and a method for producing them. L'invention concerne un tableau de connexions comprenant un matériau de base isolant, un câblage installé sur l'une des surfaces avant ou arrière dudit tableau de connexions et un élément conducteur enterré dans le matériau de base isolant. L'élément conducteur possède une extrémité exposée à la surface du matériau de base isolant et reliée au câblage, l'autre extrémité étant enterrée dans ledit matériau de base isolant. L'invention concerne également un dispositif à semi-conducteur utilisant le tableau de connexions et le procédé de production de ces deux dispositifs.
Bibliography:Application Number: WO2001JP07555