METHOD AND APPARATUS FOR EVALUATING INTEGRATED CIRCUIT PACKAGES HAVING THREE DIMENSIONAL FEATURES
The present invention provides for methods and apparatus for evaluating objects having three dimensional features. One method involve using both two dimensional data sets to improve the processing of three dimensional data sets. The two dimensional data set can be used to pre-qualify the three dimen...
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Main Authors | , , |
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Format | Patent |
Language | English French |
Published |
11.04.2002
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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