METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

A flagship line (1) comprises three different single−body processors disposed according to the respective processes in a job shop and two through processors disposed in a flow shop. A first through processor (8) comprises a die bonder (5), a clean cure section (6) and a wire bonder (7) and performs...

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Bibliographic Details
Main Authors YOSHINO, SHUUETSU, SUZUKI, TOSHIMICHI, YAMATE, YUUKI, HIRAI, NAOHIRO
Format Patent
LanguageEnglish
French
Japanese
Published 27.12.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A flagship line (1) comprises three different single−body processors disposed according to the respective processes in a job shop and two through processors disposed in a flow shop. A first through processor (8) comprises a die bonder (5), a clean cure section (6) and a wire bonder (7) and performs a through processing of die bonding, clean curing and wire bonding continuously. The second through processor (13) comprises a mark section (9), a cutting section (10), a test section (11) and a visual inspection section (12) and performs a through processing of marking, lead cutting, testing and visual inspection. The three single−body processors are a dicing unit (2), a molding unit (4) and a case plating unit (3), and leads to reduce stagnation of products between processes and to shorten the process time significantly. L'invention concerne une ligne de production pilote (1) comprenant trois unités distinctes qui correspondent à l'enchaînement des opérations de production, et deux processeurs intermédiaires sur le parcours. Un premier processeur intermédiaire (8) comporte un poste de soudage de puces (5), un poste de décapage (6) et un poste de soudage de fils (7) accomplissant en continu les opérations correspondantes. Le second processeur intermédiaire (13) comporte un poste de repérage (9), un poste de découpe (10), un poste d'essai (11) et un poste d'inspection visuelle (12) accomplissant les opérations correspondantes. Les trois unités distinctes sont les suivantes: unité de découpe de puces (2), unité de moulage (4) et unité de placage de boîtier (3). Cette configuration réduit l'attente des produits entre les opérations et raccourcit considérablement la durée de traitement.
Bibliography:Application Number: WO2001JP05052