A SUBSTRATE FOR MOUNTING A SEMICONDUCTOR DEVICE THEREON

• Main Authors: HO, WEN, SENG, ABDUL HAMID, ABDUL, KARIM, BIN, FOO, MUN, YEE
• Format: Patent
• Language: English; French
• Published: 19.12.2002
• Edition: 7
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

A substrate (16) for mounting a semiconductor chip thereon. The substrate (16) comprises a first portion adapted to have a semiconductor chip attached thereto and a mold gate portion (7), the mold gate portion (7) has a surface layer with a surface tension energy which is higher than the surface tension energy of the surface of the substrate adjacent to the mold gate portion (7), and wherein the surface layer has an edge (8) nearest to the first portion which is not linear. L'invention concerne un substrat (16) sur lequel on monte une puce à semi-conducteur, qui comprend une première partie sur laquelle on fixe une puce à semi-conducteur et une partie grille de moule (7), laquelle présente une couche superficielle dotée d'une énergie de tension superficielle supérieure à celle de la surface du substrat jouxtant la partie grille de moule (7), le bord (8) de ladite couche superficielle le plus proche de la première partie n'étant pas linéaire.