METHOD FOR ELECTROLESS DEPOSITION AND PATTERNING OF A METAL ON A SUBSTRATE
A method for manufacturing a patterned metal layer on a substrate is provided which comprises the step of electrolessly depositing a blanket metal film of a metal onto a substrate, followed by subsequently patterning said metal layer by means of microcontact printing. The deposited metal can be over...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English French |
Published |
21.11.2002
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | A method for manufacturing a patterned metal layer on a substrate is provided which comprises the step of electrolessly depositing a blanket metal film of a metal onto a substrate, followed by subsequently patterning said metal layer by means of microcontact printing. The deposited metal can be overplated with another metal, which can be microcontact printed to serve as an etch mask.
L'invention concerne un procédé de fabrication d'une couche métallique à motifs sur un substrat. Ce procédé consiste à procéder au dépôt autocatalytique d'une couche métallique de recouvrement constituée d'un métal sur un substrat, puis à former des motifs sur cette couche métallique au moyen d'une impression par microcontact. Le métal déposé peut être recouvert d'un autre métal, lequel peut subir une impression par microcontact de façon à former un masque de gravure. |
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Bibliography: | Application Number: WO2002IB01225 |