ELECTROLYTIC COPPER-PLATED R-T-B MAGNET AND PLATING METHOD THEREOF

An R-T-B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co.) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray diffraction peak intensity I(200) from the (200) plane to the X-ray diffraction peak intensity I(111) from the (...

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Bibliographic Details
Main Authors ENDOH, MINORU, NAKAMURA, TSUTOMU, ANDO, SETSUO, FUKUSHI, TORU
Format Patent
LanguageEnglish
French
Japanese
Published 17.01.2002
Edition7
Subjects
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
INDUCTANCES
MAGNETS
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
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Summary:An R-T-B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co.) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray diffraction peak intensity I(200) from the (200) plane to the X-ray diffraction peak intensity I(111) from the (111) plane is 0.1-0.45 in the X-ray diffraction by CuKa1 rays. This electrolytic copper-plating film is formed by an electrolytic copper-plating method using an electrolytic copper-plating solution which contains 20-150g/L of copper sulphate and 30-250g/L of chelating agent and contains no agent for reducing copper ions and has a pH adjusted to 10.5-13.5. L'invention porte sur un aimant R-T-B (R étant au moins un type d'élément des terres rares comprenant Y, et T étant Fe ou Fe et Co.) qui comporte un film à placage de cuivre électrolytique dont le rapport [I(200)/I(111) de l'intensité de pic de diffraction des rayons X I(200) du plan (200) à l'intensité de pic de diffraction des rayons X I (111) à partir du plan (111) est compris entre 0,1 et 0,45 dans la diffraction des rayons X par les rayons CuK alpha 1. Ce film à placage de cuivre électrolytique est formé par un procédé de placage utilisant une solution contenant de 20 à 150 g/L de sulfate de cuivre et 30 à 250 g/L d'un agent de chélation, mais ne contient pas d'agent de réduction des ions cuivre, et a un pH ajusté entre 10,5 et 13,5.
Bibliography:Application Number: WO2001JP05798