DETERGENT COMPOSITION

• Main Authors: SAKAI, AKIMITSU, TAMURA, ATSUSHI
• Format: Patent
• Language: English; French; Japanese
• Published: 20.12.2001
• Edition: 7
• Subjects: ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES; BASIC ELECTRIC ELEMENTS; CANDLES; CHEMICAL SURFACE TREATMENT; CHEMISTRY; CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DETERGENT COMPOSITIONS; DETERGENTS; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FATTY ACIDS THEREFROM; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; RECOVERY OF GLYCEROL; RESIN SOAPS; SEMICONDUCTOR DEVICES; SOAP OR SOAP-MAKING; USE OF SINGLE SUBSTANCES AS DETERGENTS

A detergent composition which is less apt to corrode wiring materials and is highly effective in cleansing a semiconductor substrate or semiconductor element having fine particles or impurity metal particles adherent thereto. The detergent composition contains a reducing agent and has an oxidation-reduction potential (25 DEG C) of +0.2 V or lower and a pH (25 DEG C) of 3 to 12. Also provided is a method of cleansing a semiconductor substrate or semiconductor element with the detergent composition. L'invention concerne une composition détergente moins corrosive pour des matériaux de cablage et hautement efficace dans le nettoyage d'un substrat semi-conducteur ou d'un élément semi-conducteur auxquels adhèrent de fines particules ou des particules d'impuretés métalliques. La composition détergente contient un agent de réduction et présente un potentiel redox (25 DEG C) de +0,2 V ou moins et un pH (25 DEG C) de 3 à 12. L'invention concerne également un procédé de nettoyage d'un substrat semi-conducteur ou d'un élément semi-conducteur avec la composition détergente.