MULTILAYERED POLYMERIC STRUCTURE

• Main Authors: FOWLER, HAROLD, C, BRYANT, EDWARD, W., S, FRIEND, STEPHEN, O
• Format: Patent
• Language: English; French
• Published: 20.12.2001
• Edition: 7
• Subjects: ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONDUCTORS; CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; CONVEYING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; INSULATORS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PACKAGES; PACKAGING ELEMENTS; PACKING; PERFORMING OPERATIONS; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; STORING; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

A multilayered polymeric structure having at least two polymeric layers is provided, each layer being a mixture of a polymeric composition with carbon fibrils. The multilayer polymeric structure may include an electrically conductive material between the first and second polymeric layers. A process for making a multilayered polymeric structure for packaging electronic components is also provided. The multilayered polymeric material is used to form trays and packages for containing electrical components. L'invention concerne une structure polymère multicouche composée d'au moins deux couches polymères, chaque couche étant constituée d'un mélange d'une composition polymère et de fibrilles de carbone. Ladite structure polymère multicouche peut comporter un matériau électriquement conducteur entre la première et la seconde couche polymères. L'invention concerne également un procédé de fabrication d'une structure polymère multicouche destinée au conditionnement des composants électroniques. Le matériau polymère multicouche selon l'invention sert à former des plateaux et des emballages pour composants électriques.