METALLIZED POLYIMIDE FILM

• Main Author: AIDA, MASAYUKI
• Format: Patent
• Language: English; French; Japanese
• Published: 11.10.2001
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PERFORMING OPERATIONS; PRINTED CIRCUITS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING

A metallized polyimide film comprising a polyimide film (1) which has been subjected to surface-roughening treatment so as to have a Ra value of 2 to 10 nm, an intermediate layer (2) which is formed on the surface having been subjected to surface-roughening treatment, comprises one or two selected from among molybdenum, silicon, and silicon monoxide, and has an average thickness of 5 to 50 % of the Ra value of the surface and, formed on the intermediate layer (2), a metal layer (4) having electrical conductivity. The metallized polyimide film exhibits an improved jointing strength between a polyimide film and a metal layer. Une couche mince en polyimide métallisée comprenant une couche mince en polyimide (1) ayant été soumise à un traitement de rugosité de surface de manière à avoir une valeur Ra de 2 à 10 nm, une couche intermédiaire (2) formée sur la surface ayant été soumise au traitement de rugosité de surface comprend 1 ou 2 éléments sélectionnés parmi le molybdène, le silicium et le monoxyde de silicium, et présente une épaisseur moyenne de 5 à 50 % de la valeur Ra de la surface et, formés sur la couche intermédiaire (2), une couche métallique (4) présentant une conductivité électrique. La couche mince en polyimide métallisée présente une meilleure résistance d'assemblage entre une couche mince en polyimide et une couche métallique.