ELECTROLESS PLATING METHOD

• Main Author: NAKAMURA, TETSUHIRO
• Format: Patent
• Language: English; French; Japanese
• Published: 05.04.2001
• Edition: 7
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A metallic film (2) of a metal on which an electroless plating film can be deposited is formed on part of the surface of a thermoelectric semiconductor (8), an object to be plated, made of a material which cannot be directly plated electrollessly. The thermoelectric semiconductor (8) is dipped in an...