METHOD OF MODIFYING A SURFACE OF A STRUCTURED WAFER

• Main Author: PENDERGRASS, DANIEL, B., JR
• Format: Patent
• Language: English; French
• Published: 14.12.2000
• Edition: 7
• Subjects: ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; DRESSING OR CONDITIONING OF ABRADING SURFACES; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GENERAL PROCESSES OF COMPOUNDING; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PERFORMING OPERATIONS; POLISHES; POLISHING; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING; WORKING-UP

A method of modifying a surface comprising the steps of: (a) contacting the surface to be modified with a working surface (47) of an abrasive article (40), the abrasive article comprising a phase separated polymer (44) having a first phase and a second phase, the first phase being harder than the second phase; and (b) relatively moving the surface to be modified and the fixed abrasive article to remove material from the surface to be modified in the absence of an abrasive slurry. La présente invention concerne un procédé de modification d'une surface comportant les étapes suivantes: (a) mise en contact de la surface à modifier avec une surface de travail (47) d'un produit abrasif (40), le produit abrasif comportant un polymère en phase distinctes (44) présentant une première phase et une deuxième phase, la première phase étant plus dure que la deuxième phase; et (b) déplacement relatif de la surface à modifier et le produit abrasif fixe en vue d'enlever de la matière de la surface à modifier en l'absence d'une barbotine abrasive.