DRY ETCHING

• Main Author: NAKATANI, ISAO
• Format: Patent
• Language: English; French; Japanese
• Published: 08.06.2000
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; SEMICONDUCTOR DEVICES

A metallic surface formed of copper, silver, gold, or one alloy selected from alloys containing as a main component at least one of these metals is etched by plasma of an etching gas containing at least nitrogen oxide while being reacted with the plasma, whereby making it possible to fine-process electrically conductive materials, heat-transfer materials and electric-contact materials consisting of an alloy containing as a main component copper, silver, gold or at least two of these metals. Cette invention se rapporte à une surface métallique qui se compose de cuivre, d'argent, d'or ou d'un alliage choisi parmi plusieurs alliages qui comprennent, en qualité de composant principal, l'un au moins des métaux susmentionnés. Cette surface métallique est gravée à l'aide du plasma d'un gaz de gravure contenant au moins un oxyde d'azote lors de la mise en réaction avec le plasma. Il est ainsi possible d'usiner finement des matériaux électroconducteurs, des matériaux de transfert thermique ainsi que des matériaux de contact électrique qui se composent d'un alliage contenant, en qualité de composant principal, du cuivre, de l'argent, de l'or ou au moins deux de ces métaux.