Semiconductor manufacturing method and laminated body

A semiconductor manufacturing method according to a present embodiment includes forming a supporter on a second surface of a semiconductor substrate opposite to a first surface to be ground of the semiconductor substrate. The semiconductor manufacturing method includes thinning the thickness of the...

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Bibliographic Details
Main Author Takano, Eiji
Format Patent
LanguageEnglish
Published 12.06.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor manufacturing method according to a present embodiment includes forming a supporter on a second surface of a semiconductor substrate opposite to a first surface to be ground of the semiconductor substrate. The semiconductor manufacturing method includes thinning the thickness of the semiconductor substrate by grinding the first surface. In the semiconductor manufacturing method, the supporter contains a resin.
Bibliography:Application Number: US201615064941