TSV compatible fiber array coupler for silicon photonics

Embodiments herein describe an apparatus for coupling a photonic chip with a plurality of optical fibers. In one embodiment, the apparatus comprises a first plurality of alignment features that correspond to a second plurality of alignment features associated with the photonic chip. Further, the app...

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Bibliographic Details
Main Authors Patel, Vipulkumar, Moyer, Steven L, Pannala, Mittu
Format Patent
LanguageEnglish
Published 12.06.2018
Subjects
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
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Summary:Embodiments herein describe an apparatus for coupling a photonic chip with a plurality of optical fibers. In one embodiment, the apparatus comprises a first plurality of alignment features that correspond to a second plurality of alignment features associated with the photonic chip. Further, the apparatus comprises a plurality of grooves for receiving the plurality of optical fibers. In one embodiment, the apparatus comprises a plurality of waveguides for transmitting or receiving an optical signal. The plurality of waveguides is optically coupled to the photonic chip, as well as the plurality of optical fibers. In one embodiment, the plurality of waveguides is passively aligned with a second plurality of waveguides associated with the photonic chip.
Bibliography:Application Number: US201715636262