Multi-axis magneto-resistance sensor package

A system and method for providing a position and orientation sensor package having a reduced size in at least one dimension is disclosed. The position and orientation sensor package includes a dielectric substrate and a first magneto-resistance sensor chip attached to the dielectric substrate, the f...

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Bibliographic Details
Main Authors Lorraine, Peter William, Nagarkar, Kaustubh Ravindra
Format Patent
LanguageEnglish
Published 12.06.2018
Subjects
ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE
MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
PHYSICS
TARIFF METERING APPARATUS
TESTING
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Summary:A system and method for providing a position and orientation sensor package having a reduced size in at least one dimension is disclosed. The position and orientation sensor package includes a dielectric substrate and a first magneto-resistance sensor chip attached to the dielectric substrate, the first magneto-resistance sensor chip including at least one magneto-resistance sensor circuit. The position and orientation sensor package also includes a second magneto-resistance sensor chip attached to the dielectric substrate and positioned adjacent the first magneto-resistance sensor chip, the second magneto-resistance sensor chip including at least one magneto-resistance sensor circuit. The position and orientation sensor package is constructed such that the at least one magneto-resistance sensor circuit of the first magneto-resistance sensor chip is oriented in a different direction than the at least one magneto-resistance sensor circuit of the second magneto-resistance sensor chip.
Bibliography:Application Number: US201514842578