Package on-package devices with upper RDL of WLPS and methods therefor

• Main Authors: Prabhu, Ashok S, Tao, Min, Haba, Belgacem, Kim, Hoki, Zohni, Wael, Sun, Zhuowen
• Format: Patent
• Language: English
• Published: 05.06.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Package-on-package ("PoP") devices with upper RDLs of WLP ("WLP") components and methods therefor are disclosed. In a PoP device, a first IC die is surface mount coupled to an upper surface of the package substrate. Conductive lines are coupled to the upper surface of the package substrate in a fan-out region with reference to the first IC. A molding layer is formed over the upper surface of the package substrate. A first and a second WLP microelectronic component is located at a same level above an upper surface of the molding layer respectively surface mount coupled to sets of upper portions of the conductive lines. Each of the first and the second WLP microelectronic components have a second IC die located below a first RDL respectively thereof. A third and a fourth IC die are respectively surface mount coupled over the first and the second WLP microelectronic components.