Semiconductor device and manufacturing method

Methods of dicing a wafer into a plurality of singulated dies are disclosed. Some methods coating sidewalls of the singulated dies with a polymer. The polymer may cover cracks formed in the sidewalls as result of dicing the wafer. Other methods may fill cracks formed in the sidewalls with a polymer....

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Bibliographic Details
Main Author Rinne, Glenn
Format Patent
LanguageEnglish
Published 22.05.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Methods of dicing a wafer into a plurality of singulated dies are disclosed. Some methods coating sidewalls of the singulated dies with a polymer. The polymer may cover cracks formed in the sidewalls as result of dicing the wafer. Other methods may fill cracks formed in the sidewalls with a polymer. Such coating and/or filling of cracks may increase the structural integrity of the die.
Bibliography:Application Number: US201615258001