Copper alloy and copper alloy sheet

Provided is a copper alloy containing 18% by mass to 30% by mass of Zn, 1% by mass to 1.5% by mass of Ni, 0.2% by mass to 1% by mass of Sn, and 0.003% by mass to 0.06% by mass of P, the remainder including Cu and unavoidable impurities. Relationships of 17≤f1=[Zn]+5×[Sn]−2×[Ni]≤30, 14≤f2=[Zn]−0.5×[S...

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Bibliographic Details
Main Authors Oishi, Keiichiro, Hokazono, Takashi, Nakasato, Yosuke
Format Patent
LanguageEnglish
Published 15.05.2018
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Summary:Provided is a copper alloy containing 18% by mass to 30% by mass of Zn, 1% by mass to 1.5% by mass of Ni, 0.2% by mass to 1% by mass of Sn, and 0.003% by mass to 0.06% by mass of P, the remainder including Cu and unavoidable impurities. Relationships of 17≤f1=[Zn]+5×[Sn]−2×[Ni]≤30, 14≤f2=[Zn]−0.5×[Sn]−3×[Ni]≤26, 8≤f3={f1×(32−f1)}1/2×[Ni]≤23, 1.3≤[Ni]+[Sn]≤2.4, 1.5≤[Ni]/[Sn]≤5.5, and 20≤[Ni]/[P]≤400 are satisfied. The copper alloy has a metallographic structure of an α single phase.
Bibliography:Application Number: US201415021012