MEMS packages and methods of manufacture thereof
Microelectromechanical systems (MEMS) packages and methods of manufacture thereof are described. In an embodiment, a method of manufacturing a MEMS package may include attaching a MEMS structure having a capping structure thereon to a device wafer comprising a plurality of first devices formed there...
Saved in:
Main Authors | , |
---|---|
Format | Patent |
Language | English |
Published |
15.05.2018
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | Microelectromechanical systems (MEMS) packages and methods of manufacture thereof are described. In an embodiment, a method of manufacturing a MEMS package may include attaching a MEMS structure having a capping structure thereon to a device wafer comprising a plurality of first devices formed therein to form a wafer level MEMS package; and singulating the device wafer having the MEMS structure attached thereto to form a plurality of chip scale MEMS packages. |
---|---|
Bibliography: | Application Number: US201514725731 |